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System-on-chip (SoC) design, RISC-V open-source cores, chiplet-based modular architectures, high-bandwidth memory (HBM) integration.
Extreme ultraviolet (EUV) lithography, 3nm and sub-3nm process nodes, advanced packaging (2.5D/3D), GaN and SiC power semiconductors.
Next-gen DRAM, NAND flash scaling, computational storage drives (CSD), persistent memory technologies.
Tensor processing units (TPUs), neuromorphic chips, in-memory computing, domain-specific AI accelerators.
Superconducting qubits, trapped-ion processors, photonic quantum chips, quantum error correction architectures.
Wide-bandgap semiconductors (GaN, SiC), high-efficiency inverters, power management ICs, wireless charging modules.
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